Deposition of Thin Films and Nanostructures

Research group at Department of Plasma Physics and Technology

Equipment

Thin film deposition systems and available equipment

Thin film deposition systems

Vinci Technologies PVD 50S

Vinci Technologies PVD 50S

Custom made PVD system, which can be utilized for simultaneous sputtering from four targets. Multiple power supplies are available (DC, p-DC and RF)

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  • Manufacturer: Vinci Technologies, France
  • Sputtering sources: 4
  • Targets: Cu, W, B4C, C, ...
  • Power supply: 2x DC, 2x RF, 2x p-DC
  • Deposition temperature: 20 °C - 750 °C
  • Base pressure: 1E-4 Pa
  • Additional information: Load-Lock, MOS (in-situ stress measurement)
Alcatel SCM 650

Alcatel SCM 650

System can be equiped with three differently shaped planar magnetrons and it's modified for HiPIMS plasma diagnostics (probe, OES and fast-camera measurements).

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  • Manufacturer: Alcatel, Sweden
  • Sputtering sources: up to 4
  • Target types: circular (3", 8") and rectangular (3" x 10")
  • Targets: Al, Cr, Cu, Nb, Ta, Ti, W, C
  • Power supplies: DC, RF, HiPIMS
  • Base pressure: 1E-4 Pa
HVM Flexilab I

HVM Flexilab I

Compact and versatile laboratory sputtering system by company HVM Plasma, which can utilize up to three targets for R&D of the next-generation thin films deposition process.

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  • Manufacturer: HVM Plasma spol s.r.o., Czech Republic
  • Devices: 2
  • Sputtering sources: up to 3
  • Target: circular 2"
  • Power supply: 3x DC, 1x p-DC, 1x RF, optional HiPIMS
  • Deposition temperature: 20°C - 600°C
  • Base pressure: 2E-5 Pa
  • Additional information: fully automated control system
HVM Flexilab II

HVM Flexilab II

Compact and versatile laboratory sputtering system by company HVM Plasma, which can utilize up to three targets for R&D of the next-generation thin films deposition process.

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  • Manufacturer: HVM Plasma spol s.r.o., Czech Republic
  • Devices: 2
  • Sputtering sources: up to 3
  • Target: circular 2"
  • Power supply: 3x DC, 1x p-DC, 1x RF, optional HiPIMS
  • Deposition temperature: 20°C - 600°C
  • Base pressure: 2E-5 Pa
  • Additional information: fully automated control system
HVM Flexilab III HiPIMS

HVM Flexilab III HiPIMS

The sputtering device operational since 2026 is the most capable and flexible HiPIMS-oriented machine in the Czech Republic encompassing complex synchronised pulsing of all three magnetron heads and the substrate allowing for the cutting-edge research of HiPIMS plasma and HiPIMS-deposited coatings.

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Material Analysis

Advanced equipment for material analysis and characteristics is available directly at the Department of Plasma Physics and Technology. It is possible to determine the morphology, micro-structure and chemical composition of deposited coatings, as well as their mechanical and tribological properties.

Tescan MIRA3

Tescan MIRA3

A scanning electron microscope for the analysis of sample surface morphology. The microscope is equipped with EDX and WDX for complex chemical analysis.

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  • Manufacturer: Tescan, Czech Republic
  • Chamber size: 340 mm x 315 mm with motorized stage
  • Maximal resolution: 1 nm @ 30 kV
  • Magnification: 2x - 1 000 000x
  • Electron gun: Schottky Field Emission
  • Detectors: SE, BSE, InBeam-SE, InBeam-BSE
  • Chemical analysis: EDX, WDX, EBIC

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  • Manufacturer: Tescan, Czech Republic
  • Chamber size: 340 mm x 315 mm with motorized stage
  • Maximal resolution: 1 nm @ 30 kV
  • Magnification: 2x - 1 000 000x
  • Electron gun: Schottky Field Emission
  • Detectors: SE, BSE, InBeam-SE, InBeam-BSE
  • Chemical analysis: EDX, WDX, EBIC
Tescan CLARA

Tescan CLARA

Scanning electron microscope for high-resolution surface morphology analysis, optimized for low-energy operation. Equipped with four segmented BSE detectors, plus EDS and STEM capabilities.

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Horiba LabRAM HR Evolution

Horiba LabRAM HR Evolution

Raman spectrometer for structural analysis of samples. The spectrometer is equipped with three lasers (IR, VIS, UV) for micro characterization of samples.

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  • Manufacturer: Horiba Scientific, Japan
  • Lasers: 325 nm (UV), 532 nm (VIS), 785 nm (NIR)
  • Spectral range: 10-2200 cm-1
  • Focal length: 800 mm
  • Lenses: 10x, 50x, 100x, achromatic (cassegrain) 74x lense
  • Additional information: 2D and 3D mapping
Hysitron TI 950 TriboIndenter

Hysitron TI 950 TriboIndenter

Advanced nanoindenter for analysis of mechanical properties of materials. It enables very accurate measurement of mechanical and tribological properties of thin films.

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  • Manufacturer: Bruker, Germany/USA
  • Methods: quasi-static indentation, scratch-testing, nanowear, SPM imaging
  • Indenter type: Berkovich
  • Load: ≤30 nN až 10 N (two head system)
  • Vertical resolution: < 0.02 nm (noise floor < 0.2 nm)
  • Maximal depth of indentation: >5 µm
ESCALAB 250Xi

ESCALAB 250Xi

A highly sensitive x-ray photoelectron spectroscope enables the qualitative and quantitative analysis of chemical composition including the depth profile and chemical bonds.

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  • Manufacturer: Thermo Fisher Scientific, United Kingdom
  • Energy Resolution: ≤ 0.45 eV (Ag 3d5/2)
  • Depth Profiling: destruction-free analysis ≤ 10 nm; destructive up to 1 µm
  • Small Area XPS: 20-900 µm
  • Methods: UV-XPS, REELS, ISS
  • Additional information: 2D mapping (spatial resolution < 3 µm)
XPS Nexsa G2

XPS Nexsa G2

A high-end X-ray photoelectron spectroscope enables reliable detail analysis of surface chemistry with high precision.

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  • Manufacturer: Thermo Fisher Scientific, CZ
Bruker DektakXT

Bruker DektakXT

Contact profilometer for the analysis of morphology with a height resolution of just 0.1 nm used primarily for the analysis of thin films and surface roughness.

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  • Manufacturer: Bruker, USA
  • Vertical Resolution: 0.1 nm max.
  • Stylus Force: from 0.03 mg to 15 mg
  • Scan Length Range: 55mm (2in.); 200mm (8in.) with scan stitching capability
  • Sample Stage: Motorized 150mm (6 in.) X/Y, manual leveling
  • Additional information: multiple stylus options ,2D and 3D analysis
NT-MDT Ntegra Prima

NT-MDT Ntegra Prima

A modular probe microscope, which enables different types of surface analysis. It is also suited for time consuming measurements thanks to its thermal stability.

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  • Manufacturer: NT-MDT, Russia
  • Scanning regimes: by probe and by sample
  • Mode: AFM (contact, semi-contact, contactless), LFM, MFM, EFM, ...
  • Frequency: 5 MHz max.
  • Scan range: 100 µm x 100 µm x 10 µm
  • Additional Information: modular system, more than 40 measuring methods, low temperature drift
LEXT OLS4000

LEXT OLS4000

Microscope is designed for nanometer level imaging, 3D measurement and roughness measurement. Magnification ranges from 108x - 17,280x.

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  • Manufacturer: Olympus, Japan
  • Laser: 405 nm
  • Lenses: 5x, 10x, 20x, 50x, 100x
  • Vertical resolution: 10 nm
  • Horizontal resolution: 120 nm
  • Additional Information: 3D projection, measurement of distance, roughness, volume, area
REVETEST Xpress plus

REVETEST Xpress plus

A device used for characterization of mechanical properties of the coating-substrate system. In combination with other equipment, it is used to measure adhesion and fracture toughness.

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  • Manufacturer: CSM Instruments, Switzerland
  • Modes: constant, progressive and incremental loads
  • Analysis: evaluation of adhesion, fracture and deformation, quantification of coatings adhesion
  • Load Range: 0.5 N - 200 N
  • Maximum Sample Size: 300 mm
  • Additional Information: matrix of scratch tests and multi-cycles for wear studies
Rigaku SmartLab Type F

Rigaku SmartLab Type F

X-ray diffractometer with a high resolution for the study of thin film microstructure (structural and phase analysis of the samples including automatic scanning).

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  • Manufacturer: Rigaku, Japan
  • X-ray source: 3 kW, sealed X-ray source with copper anode
  • Detectors: scintillatio and linear
  • Methods: diffraction, reflectivity, GID, SAXS, ...
  • Goniometer: fully automatic (resolution 0.0001°)
  • Sample size: up to 150 mm

Plasma diagnostics

Modern spectrometers, fast ICCD camera and probe diagnostics enable to study the fundamental principles of plasma utilized in sputtering systems. Combining these techniques and derived results is essential element of advanced plasma diagnostics.

Princeton Instruments PI-MAX3

Princeton Instruments PI-MAX3

ICCD camera with resolution 1024 by 1024 pixels is ideal instrument for capturing very fast processes occurring in plasma. It can capture nanosecond events.

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  • Manufacturer: Princeton Instruments, USA
  • Image resolution: 1024 x 1024
  • Frame rate: 32 MHz/16bit (eq. 26 fps)
  • Shutter speed: 3 ns, jitter < 35 ps
  • Spectral range: 200 - 900 nm
  • Additional information: dual-image capture capability (> 2 µs)
Sondová diagnostika plazmatu

Sondová diagnostika plazmatu

Probes are powerful tool for plasma description. Various types of probes are used for temporal and spatial resolution of plasma processes above the target.

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  • Types of Probes: Langmuir, strip, emissive, optical
  • Strip Probes: The measurement of local current on the target. strip probes are incorporated in the target but isolated from the rest of the target. Each strip probe is connected to the power supply to maintain the potential equal to the rest of the target. The strip probe current contribution to the total discharge current is measured separately for each probe. The temporal evolution of the current density could be determined in both non-reactive and reactive magnetron sputtering.
  • Range of Optical Probes: 350 - 1100 nm
Shamrock 750 & FHR 1000

Shamrock 750 & FHR 1000

There are available two Czerny-Turner optical spectrometers with focal lengths 750 mm and 1000 mm. They're equipped with CCD and ICCD detectors for acquiring the spectra.

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  Shamrock 750 FHR 1000
Manufacturer: Andor, United Kingdom Horiba, Francie
Type: Czerny-Turner Czerny-Turner
Focal length: 750 mm 1000 mm
F-number:  f/9.7 f/9.0
Spectral range: 200-1000 nm 200-750 nm
Diffraction grating: 600 gr/mm, 1200 gr/mm, 2400 gr/mm 2400 gr/mm, 3600 gr/mm
Spectral resolution: 0.04 nm *w/ 10µm slits 0.01 nm *w/ 10µm slits
Detectors: CCD DU940P-BU2 Andor, ICCD DH340T-18F-03 Andor Symphony CCD detectr, ICCD camera Andor IStar 720
Semion RFEA System

Semion RFEA System

The Semion Retarding Field Energy Analyser (RFEA) system measures the ion flux and ion energy distribution function hitting a surface in real-time using an imitation substrate with integrated sensors.

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  • Manufacturer: Impedans Plasma Measurement, Ireland
  • Model: single sensor
  • Compatible Plasma Types: dc, p-dc, RF, p-RF, microwave, HiPIMS
  • Time Step Resolution: 1 µs
  • Energy Resolution: 1 eV
  • Voltage Scan Range: ± 2000 V
  • Maximal Operating Temperature: 150°C
Quartz crystal microbalance

Quartz crystal microbalance

Quartz crystal micro-balance determines the flux of neutral or ionized species deposited onto a substrate. This allows us to monitor the deposition rate, even during the deposition.

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  • Manufacturer: Kurt J. Lesker, UK
  • Type: grid-less, with grid
  • Thickness Resolution: ± 0.037 Å
  • Cooling: water or air

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